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Nano Indenter® G200
Brand ：KLA
Model ：Nano Indenter® G200
Keywords ：Nano Indentation,Scratch,Friction Wear,CSM,Hardness,Modulus
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    The Nano Indenter ® G200 system is designed for nanoscale measurements during characterization and development of a wide range of materials. The system is a fully upgradeable, extendible, and production-proven platform with automated hardness measurement for quality control and assurance labs.


The Nano Indenter ® G200 system is an accurate, flexible, user-friendly instrument for nanoscale mechanical testing. The G200 measures Young’s modulus and hardness, including measurement of deformation over six orders of magnitude, from nanometers to millimeters. The system can also measure the complex modulus of polymers, gels and biological tissue as well as the creep response (strain rate sensitivity) of thin metallic films. Modular options can accommodate a variety of applications: frequency-specific testing, quantitative scratch and wear testing, integrated probe-based imaging, high-temperature nanoindentation testing, expanded load capacity up to 10N and custom test protocols.


Features

·Electromagnetic actuator to achieve the high dynamic range in force and displacement

·Modular options for imaging scratches, high-temperature nanoindentation measurements, and dynamic testing

·Intuitive interface for quick test setup;  testing parameters can be changed with just a few mouse clicks

·Real-time experimental control, easy test protocol development and precise thermal drift compensation

·Award-winning, high-speed Express Test option to measure hardness and modulus

·Versatile imaging capabilities, survey scanning, and streamlined test method development for rapid results

·Simple determination of indenter area function and load frame stiffness

Applications

·High-speed hardness and modulus measurement

·Interfacial adhesion measurement

·Fracture toughness measurement

·Viscoelastic properties measurement

·Scanning probe microscopy (3D imaging)

·Wear and scratch resistance

·High-temperature nanoindentation


High-speed Hardness and Modulus Measurement

Mechanical characterization of materials is important in the research and development of new materials. The Nano Indenter G200 is capable of measuring hardness and modulus at rates up to 1s per data point. The high-speed assessment of these mechanical properties allows semiconductor and thin film manufacturers to apply advanced technology to quality control and assurance on their production line.



·Interfacial Adhesion Measurement

Thin film delamination is generally induced by depositing a highly compressive layer that is capable of storing elastic energy. The interfacial adhesion measurement is critical to assist users in understanding the failure mode of the thin film. Nano Indenter G200 systems can initiate the interfacial fracture and measure the adhesion and residual stress properties of the multiple-layer thin film.



Fracture Toughness

Fracture toughness is the critical value of the stress-intensity factor at which catastrophic failure occurs under plane-strain conditions. Lower values of fracture toughness indicate a pre-existing flaw. Evaluating fracture toughness by nanoindentation is accomplished easily by using the Stiffness Mapping method. (Stiffness mapping requires the Continuous Stiffness Measurement and NanoVision options.)



·Viscoelastic Properties

Polymers are exceptionally complex materials; their mechanical properties depend on chemistry, processing and thermo-mechanical history. Specifically, the mechanical properties depend on the type and length of the parent chain, branching, cross-linking, strain, temperature, and frequency, and these dependencies are generally interrelated. In order to gain useful information for making decisions when designing with polymers, mechanical property measurements should be made on a relevant sample in a relevant context. Nanoindentation testing makes such context-specific measurements more accessible, because samples can be small and minimally prepared. The Nano Indenter G200 system can also be used to measure complex modulus and the viscoelastic properties of the polymer by oscillating the indenter while in contact with the materials.


·Scanning Probe Microscopy (3D Imaging)

The Nano Indenter G200 system provides two scanning probe microscopy methods to characterize the crack length of indentation impression for measurement of fracture toughness in design applications. Fracture toughness is defined as the ability of a defective material containing a crack to resist fracture. The piezo stage of the Nano Indenter G200, with its high positioning accuracy combined with the NanoVision option, provides up to 1nm encoder resolution of step size with a maximum 100µm by 100µm scan size. The Survey Scanning software option combines the X/Y motion system with NanoSuite software to provide a maximum scan size of 500µm by 500µm. Both the NanoVision stage and Survey Scanning option are required to target precise areas of samples for nanoindentation testing and calculation of fracture toughness.


Wear Resistance and Scratch Resistance

The Nano Indenter G200 system can perform scratch and wear testing on a variety of materials. Coatings and films are subjected to many processes that test the strength of these films and their adhesion to the substrate, such as chemical and mechanical polishing (CMP) and wire bonding. It is important for these materials to resist plastic deformation during these processes and remain intact without blistering on the substrate. For dielectric materials, high hardness and elastic modulus are often required to support manufacturing processes.


·High-temperature Mechanical Testing

Nanoindentation at elevated temperatures provides the ability to accurately measure the nanomechanical response of the materials up to, at and above the plasticity transition. Understanding material behavior, for example deformation mechanisms and phase transformations, can enable prediction of material failure and improve control during thermomechanical processing. Varying the temperature during the primary mechanical testing methods is one way of measuring the plasticity transition of materials that are not easily tested on the nano-scale.


Industries

·Universities, research labs and institutes

·Semiconductor and electronics industry manufacturing

·Tire industry

·Coating and paint industry

·Biomedical industry

·Medical devices

·And more: Contact us with your requirements