The P-7 builds on the success of the market leading P-17 benchtop stylus profiling system. It includes the superior measurement performance of the P-17 technology in a platform that offers a great price-to-features ratio for a benchtop stylus profiler. The P-7 stylus profiler supports 2D and 3D measurements of step heights, roughness, bow, and stress for scans up to 150mm without stitching.
·Step height: Nanometers to 1000µm
·Low force with constant force control: 0.03 to 50mg
·Scan full diameter of the sample without stitching
·Video: 5MP high-resolution color camera
·Arc correction: Removes error due to arc motion of the stylus
·Software: Easy-to-use software interface
·Production capability: Fully automated with sequencing, pattern recognition and SECS/GEM
·Step height: 2D and 3D step height
·Texture: 2D and 3D roughness and waviness
·Form: 2D and 3D bow and shape
·Stress: 2D and 3D thin film stress
·Defect review: 2D and 3D defect surface topography
·Universities, research labs, and institutes
·Semiconductor and compound semiconductor
·LED: Light emitting diodes
·MEMS: Micro-electro-mechanical systems
·And more: Contact us with your requirements
The P-7 is capable of measuring 2D and 3D step heights from nanometers to 1000µm. This enables quantification of material deposited or removed during etch, sputter, SIMS, deposition, spin coating, CMP and other processes. The P-7 has constant force control that dynamically adjusts to apply the same force on the sample surface, regardless of step height. This results in good measurement stability and enables accurate measurement of soft materials, such as photoresist.
Texture: Roughness and Waviness
The P-7 measures 2D and 3D texture, quantifying the sample's roughness and waviness. Software filters separate the measurement into the roughness and waviness components and calculate parameters, such as the root mean square (RMS) roughness.
Form: Bow and Shape
The P-7 can
measure the 2D shape or bow of a surface. This includes measurement of wafer
bow that can result from mismatch between layers during device fabrication,
such as deposition of multiple layers for the production of semiconductor or
compound semiconductor devices. The P-7 can also quantify the height and radius
of curvature of structures, such as a lens.
Stress: 2D and 3D Thin Film Stress
The P-7 is capable of measuring stress induced during the manufacture of devices with multiple process layers, such as semiconductor or compound semiconductor devices. The bow of the surface is accurately measured using a stress chuck to support the sample in a neutral position. The change in shape from a process, such as film deposition, is then used to calculate the stress by applying Stoney's equation. 2D stress is measured with a single scan across the sample diameter for samples up to 200mm without the need to stitch. 3D stress is measured using a combination of 2D scans, with the theta stage rotating between scans to measure the full sample surface.