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Candela CS920
Brand ：KLA
Model ：Candela CS920
Keywords ：Candela, Surface defects, surface inspection, defect analysis
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The KLA Candela optical surface defect analyzer (OSA) provides advanced surface detection for semiconductor and optoelectronic materials. Candela series, becoming a powerful tool for quality management and yield improvement in its manufacturing process, which can not only detect Si, gallium arsenide, indium phosphide and other opaque substrates, but also test SiC, GaN, sapphire and glass and other transparent materials.


The Candela series uses proprietary optical surface analysis (OSA) technology to measure scattering intensity, shape change, surface reflectivity and phase shift simultaneously, the Candela series detect and classify automatically for characteristic defects (DOI). OSA detection technology combines the basic principles of scattering, elliptic polarization, reflection measurement and optical shape analysis to detect residual foreign bodies on the Wafer surface, surface and subsurface defects, shape changes and uniformity of film thickness in a non-destructive manner. Candela series is a cost-effective solution with high sensitivity for new product development and production control.


Function

Main function:

Defect detection and classification.

Defect analysis

Film thickness measurement

Surface roughness measurement

Film stress detection

Features

1. The single machine solution combined with four optical detection methods in a single scan，which can realize the most efficient automatic defect detection and separation

2. Detecting the defects of LED materials automatically, which enhances the quality control of substrate, determine the root cause of defects quickly and improve the quality control ability of MOCVD.

3. Meet a variety of industrial requirements, including high brightness light emitting diode (HBLED), high power RF electronic devices, transparent glass substrate and other technologies.

4. It can be more sensitive to detect defects that affect the good rate of products in multiple semiconductor material systems

5. (Auto Defect Classification) (Particle, Scratch, Pit, Bump, and Stain Detection)

6. Automatically generate a defect mapping