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Nano Flip In-Situ Nano Indenter
Brand :KLA
Model :NanoFlip
Keywords :Indenter,Nanomechanical tests,In-Situ

    The NanoFlip nanoindenter measures hardness, modulus, yield strength, stiffness and other nanomechanical tests with high accuracy and precision under both vacuum and ambient conditions. In both scanning electron microscope (SEM) and focused ion beam (FIB) systems, the NanoFlip excels at tests, such as pillar compression, while synchronizing the SEM images with the mechanical test data. The NanoFlip performs fast measurements, which are key to testing heterogeneous materials in inert environments (e.g., glove boxes). The suite of options available, such as the InForce50 electromagnetic actuator, combine to deliver quantitative results that lead to valuable solutions in material research.

Main function:

Continuous Stiffness Measurement (CSM)

The CSM technique involves oscillating the probe during indentation to measure properties as a function of depth, force, time, or frequency. The option comes with a constant strain rate experiment that measures hardness and modulus as a function of depth or load, which is the most common test method used across academia and industry. CSM is also used for other advanced options, including the ProbeDMA™ method for storage and loss modulus measurements and AccuFilm™ substrate-independent measurements. The CSM is integrated into the InQuest controller and InView software to deliver unparalleled ease of use and data quality.


NanoBlitz3D

NanoBlitz 3D utilizes the InForce 50 actuator to generate 3D maps of measurements for high-E (>3GPa) materials with a Berkovichtip. NanoBlitz performs indents at < 1s per indent, up to 100,000 indents (300x300 array), and will provide Young’s modulus, hardness, and stiffness at a specified load for each indent in the array. This large number of tests allows increased statistical accuracy, and includes histogram charts to show multiple phases or materials. NanoBlitz 3D also provides visualization software and data handling capabilities


AccuFilm™ Thin Film Method Pack

The AccuFilm™ Thin Film Method Pack is an InView test method based on the Hay-Crawford model for measuring substrate-independent material properties using Continuous Stiffness Measurement (CSM). AccuFilm™ corrects for substrate influence on film measurements for hard films on soft substrates as well as soft films on hard substrates.


ProbeDMA™ Polymer Method Pack

The Polymer Pack enables measurement of the complex modulus of polymers as a function of frequency. The pack includes a flat-punch tip, a viscoelastic reference material, and a test method for evaluation of viscoelastic properties. This measurement technique is key to characterizing nanoscale polymers and polymer films that are not well-served by traditional DMA test instruments.


Scratch and Wear Testing Method Pack

The scratch and wear testing method pack is provided with the InForce 50 actuator. Scratch testing involves the application of either a constant or ramped load to an indenter while moving across the sample surface at a specified velocity. Scratch testing allows characterization of numerous material systems, such as thin films, brittle ceramics, and polymers.


Gemini 2D Multi-Axis Transducer

The Gemini 2D multi-axis technology brings the same performance of standard indentation to a second lateral axis, with the CSM operating along both axes simultaneously. The additional information provided by this patented technique helps give new insight to material properties and failure mechanisms. The two-dimensional force transducer is a unique solution in lateral force and tribology measurements, and enables measurements of Poisson's ratio, coefficient of friction, scratch, wear, shear and topology.


DataBurst

DataBurst enables systems equipped with InView software and the InQuest controller to record displacement data at rates >1kHzfor measuring high strain step loads, pop-in and other high speed events. NanoFlip systems outfitted with the User Method Development option can also modify methods to work with DataBurst.