On-line service
021-64283335

Home> > Products > NanoFlip

      1. Single-Chip AFM
      2. Small sample AFM
      3. Large sample AFM
      4. Biology AFM
      5. Photoinduced Force Microscope
      6. Scanning Thermal Microscopy
      7. Scanwave Impedance Microscopy
      8. AFM In-SEM
      +
      1. D series
      2. P series
      +
      1. Zeta series
      2. White light interferometer
      +
      1. Single Spot Thickness
      2. Microscopic-Spot Thickness
      3. Automated Thickness Mapping
      +
    5. +
      1. SPR Microscopy
      2. Surface plasmon resonance
      +
    7. +
    +
    1. +
      1. Nano strecher
      +
    3. +
      1. In-SEM Manipulation
      2. In-SEM Nanoindentor
      +
    +
      1. Small R&D platform
      2. Manual Probe Station
      3. Automated Probe Station
      4. High Power Probe Station
      +
      1. Needles&Accessories
      +
    +
      1. In-SEM Atomic Microscopy
      +
      1. In-SEM Nanoindentor
      2. In-SEM Nano Manipulation
      +
      1. In-Situ Chips&Holder
      +
    +
      1. Nanoimprinter Research
      +
      1. PLD Pulse Laser Deposition
      +
      1. Passive isolation station
      2. Active isolation station
      +
    +
      1. AFM Probes
      2. AFM Standard
      3. AFM Sample holder
      +
      1. Silicon Nitride Film Window
      2. Quantifoil
      3. TEM Accessories
      4. SEM Accessories
      5. X-ray Accessories
      +
      1. GGB Needles
      +
      1. Grating mold
      2. Pillar mold
      3. Hole mold
      +
    5. +
    +
NanoFlip
Brand ：KLA
Model ：NanoFlip
Keywords ：In-SEM,In-Situ,Nanoindentor
Download Brochure

      The NanoFlip nanoindenter measures hardness, modulus, yield strength, stiffness and other nanomechanical tests with high accuracy and precision under both vacuum and ambient conditions. In both scanning electron microscope (SEM) and focused ion beam (FIB) systems, the NanoFlip excels at tests, such as pillar compression, while synchronizing the SEM images with the mechanical test data. The NanoFlip performs fast measurements, which are key to testing heterogeneous materials in inert environments (e.g., glove boxes). The suite of options available, such as the InForce50 electromagnetic actuator, combine to deliver quantitative results that lead to valuable solutions in material research.


Product Description

      The NanoFlip has a high precision XYZ motion to position the sample for testing and a flip mechanism to position the sample for imaging. The InView software comes with a suite of test methods that cover a range of test protocols, and also allows users to create their own novel test methods. The InForce50 actuator performs equally well in both vacuum and ambient conditions. SEM or other microscope images can be recorded by the InView software and synchronized with the mechanical test data. The revolutionary FIB-to-Test technology allows tilting the sample 90°, allowing a seamless transition from FIB to indentation test without having to remove the sample.

Features


  • InForce 50 actuator for capacitance displacement measurement and electromagnetic force actuation with interchangeable tips
  • InQuest high-speed controller electronics with 100kHz data acquisition rate and 20µs time constant
  • XYZ motion system for sample targeting
  • SEM video capture for synchronized SEM images with test data
  • Unique software-integrated tip-calibration system for fast, accurate tip calibration
  • InView control and data review software with Windows ®10 compatibility and method developer for user-designed experiment
Applications


  • Hardness and modulus measurements (Oliver-Pharr)
  • Continuous stiffness measurement
  • High speed material property maps
  • ISO 14577 hardness testing
  • Nano Dynamic Mechanical Analysis (DMA)
  • Quantitative scratch and wear testing
Industries


  • Universities, research labs and institutes
  • Pillar and microsphere manufacturing
  • MEMS: Micro-electro-mechanical systems
  • Materials manufacturing (structure compression/tensile/fracture testing)
  • Battery and component manufacturing

Measurement of Hardness and Modulus(Oliver-Pharr)

CSM Measurment

0.1Hz-1kHz


Mapping（3D/4D）



DMA

Scratch